Hp Inc C O Inventec Chongqing Co Ltd Import Data from United States

As of 2026-07-21, Hp Inc C O Inventec Chongqing Co Ltd is recorded in United States trade data on TradeInt, importing goods into United States from CHINA. Its bill of lading records cover products such as THERMAL MODULE,INTEL ADL U,UMA ,15W,CHIPS THERMAL MODULE,AMD FP7 U,UMA,1 5W,CHIPSET THERMAL MODULE,AMD FP7 U,UMA,2 8W,CHIPSET FPC,IR,209X9.5X0.3MM,0.3/0.5MM ,PET,D,G/F FFC,6PALSPANEL,417X3.5X0.3MM,0 .3/0.5MM,P FFC,10P CLICK,56X5.5X0.3MM,0.3 /0.5MM,PET FFC,10P CLICK,65X5.5X0.3MM,0.3 /0.5MM,PET FFC,8P FINGER,66X4.5X0.3MM,0.3 /0.5MM,PET FFC,10P RGB,161X7X0.3MM,0.3/0. 5MM,PET,S, FFC,6P ALS,190X3.5X0.3MM,0.5/0 .5MM,PET,S FFC,6PALSPANEL,317.5X3.5X0.3MM ,0.3/0.5MM FFC,8P FINGER,66X4.5X0.3MM,0.3 /0.5MM,PET FFC,15P NFC,90.5X8X0.3MM,0.3/0 .5MM,PET,S FFC,10P CLICK,51.5X5.5X0.3MM,0 .3/0.5MM,P FPC,IR,2L,209X9.5X0.3MM,0.3/0. 2MM,0.2MM, E.SET,FPC+2ALS,49.81X13X1.1MM E.SET,FPC+AUDIO,19.2X25.2X6MM E.SET,FPC+AUDIO,19.2X25.2X6MM E.SET,FPC+AUDIO,19.2X25.2X6MM HOLDER,BOTTOM IO,LEFT,PC+ABS GASKET,CF,65MM,6MM,3MM SET,COVER,HINGE,16W SET,HINGE CAP,DISPLAY,14P SET,HINGE CAP,DISPLAY,14W SET,BEZEL,DISPLAY,IR SET,BEZEL,DISPLAY,IR,13 SET,COVER,HINGE,13 ASSEMBLY,CASE,REAR,DISPLAY,WWA N,THICK,14 ASSEMBLY,BASE,KEYBOARD,SUB,US, 14 PART NO: H6833127 H6833128,H6833130 H6833078,H6833080 H6833081,H6833082 H6833083,H6833084 H6833086,H6833087 H6833088,H6833090 H6833092,H6833093 H6833133,H6833134 H6833135,H6833137 H6833154,H6833210 H6833221,H6833223 H6833224,H6833218 H6833219,H6833222 H6832693,H6832704 PO : 4516576932 4516576933,4516576935 4516576883,4516576885 4516576886,4516576887 4516576888,4516576889 4516576891,4516576892 4516576893,4516576895 4516576897,4516576898 4516576938,4516576939 4516576940,4516576941 4516576958,4516577014 4516577025,4516577027 4516577028,4516577022 4516577023,4516577026 4516576499,4516576510 INV: H628833127 H628833128,H628833130 H628833078,H628833080 H628833081,H628833082 H628833083,H628833084 H628833086,H628833087 H628833088,H628833090 H628833092,H628833093 H628833133,H628833134 H628833135,H628833137 H628833154,H628833210 H628833221,H628833223 H628833224,H628833218 H628833219,H628833222 H628832693,H628832704 HS CODE:8473309000 8534009000,8544491900 5911900090, 442 CARTONS INTO 21 PALLETS HPI-FTZ - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA 0005579523 AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB8 TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY3: HP INC. 1501 PAGE MILL ROAD SANTA CLARA 94304 PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM (650)857-1501 TEL : 1- (915) 298-5210 / 52-656-2761340 2ND NOTIFY:SAMSUNG SDS AMERICA, INC. 12631 E.IMPERIAL HIGHWAY, SUITE F216, SANTA FE SPRING90670 LA.OPERATION SAMSUNG.COM JUN YEON KIM 714-497-6412, CABLE,ROUND,40POS,198MM,I,EDP, 2 LANE,TOP KEYBOARD,84,PVCY BL,42P,BLACK, BRA,273.32 IC,DRIVER MOSFET,30A,TQFN-21,2 1P,TR IC,DC/DC CONVERTER,SOT23-6,6P, TR FPC,USB,1L,31.8X61.7X0.2MM,0.3 /0.3MM,PET SHIELD,PCB,TOP,ABSORBER,ADHESI VE,180 BATTERY SET,LI,3V,70MAH,CELL,C R1620,17X2 BATTERY SET,LI,3V,70MAH,CELL,C R1620,17X2 DIODE,SWCH,100V,250MW,4NS,SMD, SOD323,TR TRANSISTOR-FET,NEMOS,20V,0.75A ,DFN1006-3 IC,AUDIO AMPLIFIER,WLCSP,31P,T R FRAME,TOP,BTY,PC ABS 15 TALC, R 16 BRACKET,SUPPORT,AMD TOP,SGCC,1 4 THERMAL MODULE,AMD FP7 U,UMA,2 8W,CHIPSET KEYBOARD,84,BL,42P,BLACK,L/A,2 73.35X111. MODULE,FINGER PRINT,PIKE SILVE R ASSEMBLY,CASE,REAR,DISPLAY,WLA N,16W,AL P ASSEMBLY,CASE,REAR,DISPLAY ASSEMBLY,CASE,BOTTOM,INT,13 ASSEMBLY,CASE,BOTTOM,THICK,14P KEYBOARD,101,BL,42P,BLACK,USA, 330.69X115 KEYBOARD,101,BL,42P,BLACK,USA, 330.69X110 PART NO: H6814127,H6833118 H6829554,H6829542 H6829549,H6829550 H6829562,H6833073 H6833074,H6832814 H6833013,H6833039 H6838192,H6838193 H6838194,H6838196 H6833126,H6832711 H6832714,H6832715 H6832716,H6833116 PO : 4516538229,4516576923 4516570166,4516569881 4516569887,4516569889 4516570177,4516576877 4516576878,4516576615 4516576824,4516576850 4516592025,4516592026 4516592028,4516592033 4516576931,4516576517 4516576520,4516576521 4516576522,4516576921 INV: H628814127,H628833118 H628829554,H628829542 H628829549,H628829550 H628829562,H628833073 H628833074,H628832814 H628833013,H628833039 H628838192,H628838193 H628838194,H628838196 H628833126,H628832711 H628832714,H628832715 H628832716,H628833116 HS CODE:8544421900,8471609000 8471607100,8542319099 8534009000,8473309000 8506500000,8541100000 8541210000,8542339000 357 CARTONS INTO 24 PALLETS HPI-FTZ - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA 0005579523 AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB8 TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY3: HP INC. 1501 PAGE MILL ROAD SANTA CLARA 94304 PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM (650)857-1501 TEL : 1- (915) 298-5210 / 52-656-2761340 2ND NOTIFY:SAMSUNG SDS AMERICA, INC. 12631 E.IMPERIAL HIGHWAY, SUITE F216, SANTA FE SPRING90670 LA.OPERATION SAMSUNG.COM JUN YEON KIM 714-497-6412 and ASSEMBLY,CASE,REAR,DISPLAY,WWA N,THIN,14W ASSEMBLY,CASE,RE AR,DISPLAY,WWA N,THICK,13 AS SEMBLY,CASE,REAR,DISPLAY,WWA N,THIN,14W ASSEMBLY,CASE,BOT TOM,UMA,THIN, 16W PART NO: H 6813766 H6822775,H6822780 H 6822782 PO#: 4516538328 4516 555332,4516555342 4516555346 INV: H628813766 H628822775, H628822780 H628822782 HS COD E:8473309000 374 CARTONS INTO 21 PALLETS HPI-FTZ - RAW MAT ERIALS OCF/DESTINATION/LOCAL CHARGES COLLECT AT USA BY HP USA SVC: 33101405359 AS THI S IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB8 TO I NVENTEC MEXICO ON BL.ALSO, PL EASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRAN GEMENT. NOTIFY3: HP INC. 1 501 PAGE MILL ROAD SANTA CLAR A 94304 PALO ALTOUNITED STATE S [email protected] (650)857-1501 ---TEL : 1- (9 15) 298-5210 / 52-656-2761340 under HS codes 847330 and 854442. Each record includes the exporter, importer, country of origin, destination country, trade value, weight, quantity, and ports of loading and discharge.