HS Code 3919902000: Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers, of plastics in Spain

Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : For use in certain types of aircraft

Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Other : Transparent poly(ethylene terephthalate) self-adhesive film: -|free from impurities or faults, -|coated on one side with an acrylic pressure sensitive adhesive and a protective liner, and on the other side with an antistatic layer of ionic organic choline compound, -|whether or not with a printable dust-proof layer of modified long chain alkyl organic compound, -|with a total thickness without the liner of 54|?m or more but not more than 64|?m, and -|a width of more than 1|295|mm but not more than 1|305|mm

Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Polyester film: -|coated on one side|with an acrylic thermal release adhesive that debonds at temperatures of|90|°C or more but not more than|200|°C, and a polyester liner, and -|on the other side not coated or coated with an acrylic pressure sensitive adhesive or with an acrylic thermal release adhesive that debonds at temperatures of|90|°C or more but not more than| 200|°C, and a polyester liner

Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Polytetrafluoroethylene film, -|with a thickness of 50|µm or more but not more than 155|µm, -|with a width of 6,30|mm or more but not more than 585|mm, -|an elongation at break of not more than 200|%, and -|coated on one side with a pressure sensitive silicone adhesive with a thickness|of not more than 40|µm

Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Polyester, polyethylene or polypropylene film coated on one or both sides with an acrylic and/or rubber pressure sensitive adhesive, whether or not supplied with a release liner, put up in rolls of a width of 45,7 cm or more but not more than 160 cm

Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Film consisting of 1|to 3|laminated layers of poly(ethylene terephthalate) and a copolymer of terephthalic acid, sebacic acid and ethylene glycol, coated on one side with an acrylic abrasion resistant coating and on the other side with an acrylic pressure sensitive adhesive, a water soluble methylcellulose coating and a poly(ethylene terephthalate) protective liner

Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Reflecting laminated sheet: -|consisting of an epoxy acrylate layer embossed on one side in a regular shaped pattern, -|covered on both sides with one or more layers of plastic material and -|covered on one side with an adhesive layer and a release sheet

Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Ethylene vinyl acetate film: -|of|a thickness of 100|µm or more, -|coated on one side with an acrylic pressure sensitive or UV-sensitive adhesive and a polyester|or polypropylene liner

Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Poly(vinyl chloride), poly(ethyleneterephthalate), polyethylene or any other polyolefin film: -coated on one side with an acrylic UV-sensitive adhesive and a liner -of a total thickness of 65 ?m or more without release liner

Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Reflecting sheet: -|of a polycarbonate or acrylic polymer film embossed on one side in a regular shaped pattern -|covered on one or both sides with one or more layers of plastic or metallisation, and -|whether or not covered on one side with a self-adhesive layer and a release sheet