HS Code 3919908041: Other Self-Adhesive Plastic Films
HS code 3919908041 is an 10-digit code for Other Self-Adhesive Plastic Films, under the 6-digit subheading 391990. The first 6 digits are standardized worldwide; the digits beyond are set by each country.
See real import & export shipment data for 3919908041HS Code 3919908041 Description by Country
3919908041 is listed across 27 countries' HS schedules. The table below shows how each country defines it under its own standard, with the local description and a link to its real import and export trade data.
Austria HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Belgium HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Bulgaria HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Croatia HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Cyprus HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Czech Republic HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Denmark HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Estonia HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Finland HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
France HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Germany HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Greece HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Hungary HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Ireland HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Italy HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Latvia HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Lithuania HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Luxembourg HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Malta HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Netherlands HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Poland HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Portugal HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Romania HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Slovakia HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Slovenia HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Spain HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Sweden HS Code
HS Code 3919908041 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls > 20 cm wide (excl. floor, wall and ceiling coverings of heading 3918, and circular polishing pads used in semiconductor wafer production)) : Adhesive film consisting of a base of a copolymer of ethylene and vinyl acetate (EVA) of a thickness of 70 µm or more and an adhesive part of acrylic type of a thickness of 5 µm or more, for use in the grinding and/or dicing process of silicon discs
Frequently Asked Questions
What is HS code 3919908041?
HS code 3919908041 is an 10-digit code for Other Self-Adhesive Plastic Films, under the 6-digit subheading 391990 of the Harmonized System. The first 6 digits are standardized worldwide; the rest are national.
Is HS code 3919908041 the same in every country?
Which countries use HS code 3919908041?